PCB Manufacturing

/PCB Manufacturing
PCB Manufacturing2019-10-17T11:21:29+08:00

PCB Manufacturing Capability

FeatureCapability
PCB TypeRigid PCB(CEM, FR4), Flexible PCB, Rigid-Flex PCB, MCPCB(Aluminum PCB), Ceramic PCB, RF PCB, etc.
Number of Layers1 – 32layers
Order Quantity1pc – 10,000,000 pcs
Build Time2days – 5weeks (Expedited Service)
MaterialFR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board SizeMin 6*6mm | Max 600*700mm
Board size tolerance±0.1mm – ±0.3mm
Board Thickness0.4mm – 3.2mm
Board Thickness Tolerance±0.1mm – ±10%
Copper Weight0.5oz – 6.0oz
Inner Layer Copper Weight0.5oz – 2.0oz
Copper Thickness Tolerance+0μm +20μm
Min Tracing/Spacing3mil/3mil
Solder Mask SidesAs per the file
Solder Mask ColorGreen, White, Blue, Black, Red, Yellow
Silkscreen SidesAs per the file
Silkscreen ColorWhite, Blue, Black, Red, Yellow
Surface FinishHASL – Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS
Immersion Silver – RoHS
Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS
Min Annular Ring3mil
Min Drilling Hole Diameter6mil, 4mil-laser drill
Min Width of Cutout (NPTH)0.8mm
NPTH Hole Size Tolerance±.002″ (±0.05mm)
Min Width of Slot Hole (PTH)0.6mm
PTH Hole Size Tolerance±.003″ (±0.08mm) – ±.006″ (±0.15mm)
Surface/Hole Plating Thickness20μm – 30μm
SM Tolerance (LPI).003″ (0.075mm)
Aspect Ratio1.10 (hole size: board thickness)
Test10V – 250V, flying probe or testing fixture
Impedance tolerance±5% – ±10%
SMD Pitch0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Chamfer of Gold Fingers20, 30, 45, 60
Other TechniquesGold fingers
Blind and Buried Holes
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cut/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Electrical Test