PCB Manufacturing | FR4 PCB, PCB Prototype, Small and Production Run

PCB Manufacturing Capability

Feature	Capability
PCB Type	Rigid PCB(CEM, FR4), Flexible PCB, Rigid-Flex PCB, MCPCB(Aluminum PCB), Ceramic PCB, RF PCB, etc.
Number of Layers	1 – 32layers
Order Quantity	1pc – 10,000,000 pcs
Build Time	2days – 5weeks (Expedited Service)
Material	FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board Size	Min 66mm \| Max 600700mm
Board size tolerance	±0.1mm – ±0.3mm
Board Thickness	0.4mm – 3.2mm
Board Thickness Tolerance	±0.1mm – ±10%
Copper Weight	0.5oz – 6.0oz
Inner Layer Copper Weight	0.5oz – 2.0oz
Copper Thickness Tolerance	+0μm +20μm
Min Tracing/Spacing	3mil/3mil
Solder Mask Sides	As per the file
Solder Mask Color	Green, White, Blue, Black, Red, Yellow
Silkscreen Sides	As per the file
Silkscreen Color	White, Blue, Black, Red, Yellow
Surface Finish	HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS
Min Annular Ring	3mil
Min Drilling Hole Diameter	6mil, 4mil-laser drill
Min Width of Cutout (NPTH)	0.8mm
NPTH Hole Size Tolerance	±.002″ (±0.05mm)
Min Width of Slot Hole (PTH)	0.6mm
PTH Hole Size Tolerance	±.003″ (±0.08mm) – ±.006″ (±0.15mm)
Surface/Hole Plating Thickness	20μm – 30μm
SM Tolerance (LPI)	.003″ (0.075mm)
Aspect Ratio	1.10 (hole size: board thickness)
Test	10V – 250V, flying probe or testing fixture
Impedance tolerance	±5% – ±10%
SMD Pitch	0.2mm(8mil)
BGA Pitch	0.2mm(8mil)
Chamfer of Gold Fingers	20, 30, 45, 60
Other Techniques	Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test